SAMSUNG KMQE10013M-B318: TECHNICAL ANALYSIS AND APPLICATION PROSPECTS

Samsung KMQE10013M-B318: Technical Analysis and Application Prospects

Samsung KMQE10013M-B318: Technical Analysis and Application Prospects

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KMQE10013M B318

What is KMQE10013M-B318?


As an important chip of Samsung Semiconductor, KMQE10013M-B318 has become the focus of market attention with its excellent performance and wide application fields. This article will deeply analyze the characteristics and value of this chip from the aspects of technical specifications, application scenarios, market positioning and future development trends.

KMQE10013M-B318 Technical Specifications


Storage capacity:

  • eMMC flash memory: 16GB, compliant with eMMC 5.1 standard.

  • LPDDR3 DRAM: 16Gb (2GB), data transfer rate can reach 1866 Mbps.


Package type:

  • Package form: 221 ball grid array (FBGA).

  • Dimensions: 11.5 mm x 13 mm x 1.0 mm.


Manufacturing process:

  • eMMC process: 14nm.

  • DRAM process: 20/18/18nm.


Power supply voltage:

  • DRAM voltage: 1.2V.

  • eMMC voltage: 1.8V/3.3V.


Data transfer rate:

  • eMMC: supports 200MHz DDR mode, bus width is 8 bits, and the maximum data transfer rate can reach 400MBps.


 

KMQE10013M-B318 Features


1. Highly integrated



  • eMMC flash memory + LPDDR3 DRAM two-in-one: Integrates 16GB eMMC flash memory and 16Gb (2GB) LPDDR3 DRAM, simplifying PCB design, saving space and reducing power consumption.

  • Package type:221-Ball FBGA (ball grid array package), size is about 11.5mm × 13mm × 1.0mm, suitable for miniaturized devices.


2. High-speed storage performance



  • eMMC 5.1 standard: supports HS400 (200MHz DDR, 8-bit bus), maximum data transfer rate of 400MB/s, improves device access speed.

  • LPDDR3 DRAM rate: data transfer rate can reach 1866 Mbps, improves system operation smoothness.


3. Low power consumption & high efficiency



  • DRAM low voltage operation: operating voltage 1.2V, more energy-efficient than DDR3, helps to extend battery life.

  • eMMC low power management: supports Deep Power Down (deep sleep mode), optimizes power management of mobile devices.


4. Strong compatibility



  • Applicable to a variety of mobile platforms: compatible with Android, MTK, Qualcomm, Spreadtrum and other mainstream mobile chipsets.

  • Widely used in mid-to-high-end smart devices: such as Samsung J series, some Nokia models and other smartphones and tablets.


5. Improved reliability



  • eMMC 5.1 error correction function (ECC): Improve data storage stability and reduce the risk of flash memory damage.

  • LPDDR3 self-refresh function: Optimize data retention and improve multi-tasking capabilities.


 

Application scenarios of KMQE10013M-B318


KMQE10013M-B318 is a highly integrated eMCP (embedded multi-chip package) memory that combines 16GB eMMC 5.1 flash memory and 2GB LPDDR3 DRAM. It is widely used in mobile devices and embedded systems. The following are its main application scenarios:

1. Smartphones



  • Suitable for mid-to-low-end to mid-to-high-end smartphones, providing cost-effective storage solutions.

  • Compatible with mainstream mobile chipsets (such as Qualcomm, MediaTek (MTK), Spreadtrum).

  • Adopts eMMC 5.1 high-speed storage to support smooth multi-tasking and application loading.

  • Low power design (1.2V LPDDR3 + low power eMMC) helps extend battery life.


Representative models:

  • Samsung J series (such as J500F, J500H, J320).

  • Some Nokia models (such as K500DSZ, K430DSY, TA-1032, TA-1053).


2. Tablets



  • Suitable for entry-level and mid-range Android tablets, providing sufficient storage and memory to run multimedia applications.

  • eMMC 5.1 high-speed data read and write, supporting high-definition video playback and streaming applications.

  • LPDDR3 low-power memory reduces tablet power consumption and improves battery life.


3. Internet of Things (IoT) devices


Suitable for smart homes and industrial IoT terminals, such as:

  • Smart cameras

  • Smart speakers

  • Smart routers


The eMCP solution can optimize cost, performance and power consumption, and is suitable for IoT devices that run for a long time.

4. Wearable devices



  • Suitable for small devices such as smart watches, smart glasses, and smart bracelets.

  • Small size package (FBGA 221) is suitable for compact devices and reduces PCB space.

  • Low power operation helps wearable devices extend battery life.


5. Industrial embedded systems



  • Suitable for embedded applications such as POS machines, car navigation, and medical equipment.

  • High durability & high compatibility, able to run on a variety of motherboard platforms.

  • eMMC 5.1 has ECC error correction mechanism to improve data reliability.


6. Education & enterprise-level equipment



  • Suitable for educational electronic products (such as learning tablets, electronic dictionaries).

  • Enterprise-level office equipment (such as office terminals, portable POS machines).

  • It has good storage and computing performance and can meet the needs of daily office and education applications.


 

Samsung KMQE10013M-B318 Market Competitiveness Analysis


1. Market Advantage Analysis


(1) Brand and Industry Position

  • Samsung Electronics is the world's leading memory chip manufacturer, and has long been at the forefront of market share in the NAND flash memory and DRAM fields (competing with Micron and SK Hynix).

  • Samsung's eMCP product line is mature, covering the low-end to high-end markets, and has been widely recognized by mobile phone manufacturers and IoT equipment manufacturers.

  • The stable supply chain ensures the market supply of products and reduces price fluctuations caused by chip shortages.


(2) Technology & Product Competitiveness

High integration:

  • eMCP packaging combines eMMC and LPDDR3 to simplify PCB design, suitable for small devices, and enhance competitiveness.


Excellent storage performance:

  • eMMC 5.1 (HS400 mode), read and write speeds are improved compared to version 5.0, up to 400MB/s.

  • LPDDR3 DRAM (1866 Mbps), suitable for low-end and mid-end devices, provides a smooth operating experience.


Low power design:

  • 1.2V LPDDR3 + low power eMMC, suitable for smartphones, IoT, wearable devices, and improved battery life.


Wide compatibility:

  • Adapts to mainstream SoC solutions such as MediaTek (MTK), Qualcomm (Qualcomm), and Spreadtrum (UNISOC), making it easy for smartphone and IoT device manufacturers to integrate.


(3) Market demand & application scenarios

  • Mainly for entry-level & mid-range smartphones (such as Samsung J series, Nokia, and some domestic mobile phones).

  • Applicable to tablets, wearable devices, Internet of Things (IoT) devices, and industrial embedded devices.

  • Affected by the growth of IoT devices in the 5G era, the demand for eMCP has increased, especially in the fields of smart cameras, smart speakers, POS machines, etc.


2. Market Disadvantages and Challenges


(1) Storage specifications lag behind the high-end market

eMMC 5.1 has been gradually replaced by UFS:

  • UFS 2.1/3.0/3.1 is much faster than eMMC, and mid-to-high-end devices prefer UFS.

  • UFS read speed can reach more than 1GB/s, while eMMC is only 400MB/s.

  • New smartphones and flagship phones prefer UFS solutions, and KMQE10013M-B318 is only suitable for the low-end market.


LPDDR3 has been replaced by LPDDR4/4X/5:

  • LPDDR4X and LPDDR5 have higher bandwidth and lower power consumption, and high-end devices have been fully upgraded.

  • KMQE10013M-B318 is only suitable for entry-level devices, and its competitiveness in the high-end market has declined.


(2) Price competition & supply chain challenges

Intense competition in the low-end market:

  • eMCP solutions face competition from Micron, SK Hynix, Kingston and other manufacturers in mid- and low-end devices.

  • Domestic memory chip manufacturers (such as Yangtze Memory and GigaDevice) gradually occupy the market share and provide more cost-effective eMMC solutions.


Raw material price fluctuations:

  • NAND flash memory & DRAM prices are greatly affected by market fluctuations, and costs may be affected.

  • Tight supply chains may affect delivery capabilities, especially in the context of epidemics and global chip shortages.


3. Analysis of main competitors









































Brand Product model Specifications Competitive advantages and disadvantages
Samsung KMQE10013M-B318 6GB eMMC 5.1 + 2GB LPDDR3 High brand recognition and strong compatibility, but eMMC competitiveness has declined
Micron MT29TZZZ8D5JKEB 16GB eMMC 5.1 + 2GB LPDDR3 Similar performance and high market share
SK Hynix H9TQ17ABJTMC 16GB eMMC 5.1 + 2GB LPDDR3 Rich storage product line, leading in some markets
Yangtze River Storage (domestic) eMCP 16GB+2GB eMMC 5.1 + 2GB LPDDR3 Obvious price advantage, domestic manufacturers begin to seize the market
Kingston EMCP 16GB + 2GB eMMC 5.1 + LPDDR3 Stable supply chain, high market share in some markets

 

Samsung Advantages and Disadvantages of KMQE10013M-B318


Advantages：


Highly integrated, space-saving

  • Adopting the eMCP (eMMC + LPDDR3 two-in-one) solution, NAND flash memory and DRAM are combined in one package to simplify PCB design and reduce space occupied.

  • Suitable for miniaturized devices (such as smartphones, wearable devices, and IoT terminals).


Strong compatibility

  • Supports mainstream SoC solutions, compatible with Qualcomm, MediaTek (MTK), Spreadtrum (UNISOC) and other chipsets, suitable for a wide range of smart devices.

  • eMMC 5.1 standard, can run stably on different mobile operating systems (such as Android).


Good performance

  • eMMC 5.1 (HS400 mode), with a maximum transmission speed of 400MB/s, is faster than eMMC 5.0 and is suitable for mid- and low-end devices.

  • LPDDR3 has a rate of 1866 Mbps, which is more power-efficient and faster than DDR3, and is suitable for daily applications (such as running apps smoothly and multitasking).


Low-power design

  • LPDDR3 runs at a low voltage (1.2V), which is more energy-efficient than DDR3 and improves the battery life of smartphones and IoT devices.

  • eMMC 5.1 low-power management (supports Deep Power Down mode) to further reduce power consumption when in standby mode.


High reliability

  • eMMC 5.1 has ECC (error correction function), which improves the stability and durability of stored data and reduces the risk of NAND particle damage.

  • Adopting FBGA 221 ball grid package (BGA), it has good heat dissipation performance and improves device durability.


 

Disadvantages:


Gradually falling behind new technologies

  • eMMC 5.1 has been replaced by UFS:



  1. UFS 2.1/3.1 has faster read and write speeds (>1GB/s), and is more suitable for mid-to-high-end devices than eMMC.

  2. Modern smartphones and tablets prefer UFS storage solutions, and eMMC is mainly used in low-end devices and IoT fields.



  • LPDDR3 has been replaced by LPDDR4X/LPDDR5:



  1. LPDDR4X has lower power consumption and higher bandwidth, and has become mainstream.

  2. LPDDR5 is faster and more energy-efficient, suitable for high-end devices, and LPDDR3 is gradually withdrawing from the market.


Limited storage capacity

  • Only 16GB eMMC flash memory and 2GB LPDDR3 memory are provided, which is small for modern application needs:

  • Modern mobile phones and applications have greater storage requirements, and 16GB ROM storage has gradually been replaced by 32GB/64GB/128GB.

  • 2GB RAM is only suitable for entry-level devices, and performance bottlenecks may occur when running multitasking or large APPs.


Fierce competition in the low-end market

  • Domestic storage chip manufacturers (such as Yangtze Memory, GigaDevice, etc.) are intensifying competition in the low-end market, providing more competitively priced eMCP solutions, and Samsung is facing greater pressure.

  • Storage vendors such as Micron, SK Hynix, and Kingston are also offering similar products, and their market share is being divided.


Price fluctuations & supply chain challenges

  • The price of storage chips is greatly affected by market fluctuations. For example, when the price of NAND flash memory & DRAM rises, the cost of eMCP increases, resulting in a narrowing profit margin.

  • Supply chain tensions (such as epidemics and chip shortages) may affect supply stability, causing OEMs to turn to other suppliers.


 

KMQE10013M-B318 datasheet


KMQE10013M-B318 datasheet PDF

Conclusion


As a high-performance and high-reliability chip, Samsung KMQE10013M-B318 occupies an important position in the market with its advanced technology and a wide range of application scenarios. In the future, with the continuous innovation of technology and the growth of market demand, this chip is expected to play its value in more fields and inject new impetus into the development of the industry.

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